Wet Etching of Silicon Wafer by KOH Setup

Etching Equipment

Wet etching is one of the commonly used methods for isotropic etching of silicon. In this method, by using KOH solution with certain molarity, at a specified temperature the silicon etching process begins and continues at a defined rate. Any contamination, temperature variation and lack of uniformity in the wet etching system causes disruption in the process and the desired pattern will not be achieved. Designing a wet etching system to keep the uniformity of etching condition is highly important.


  • <111>, <100> Silicon Etching

    Unit Each Run Amount : 2,000,000 Rls.