Deposition by Sputtering System

Deposition Equipment

RF sputtering is one of the most common deposition system in every FAB. In fact, in this system particles are ejected from a solid target material through the bombardment of the target by energetic particles, particularly inert gas ions and then these particles are deposited onto a substrate. Since the sputtering system are widely used in the deposition of ceramics and refractories, it has many applications in FAB. In this regard, deposition of metals including chromium, platinum, nickel, and materials like metal oxides such as tin oxide, etc., can be named. Even the deposition of specific compounds like superconductors (YBCO) can also be carried out by this system.

 

 

 

Service

  • Deposition of Cr, Si, SiO2, Ni, Cu, Ge, Au, ITO, Ti, Al2O3, Zn, ZnO2 Layers with a thickness in the range of 3 to 200 nm

    Unit Each Run Amount : 2,500,000 Rls.
  • Deposition of Cr, Si, SiO2, Ni, Cu, Ge, Au, ITO, Ti, Al2O3, Zn, ZnO2 Layers with a thickness in the range of 200 to 400 nm

    Unit Each Run Amount : 3,500,000 Rls.
  • Deposition of Cr, Si, SiO2, Ni, Cu, Ge, Au, ITO, Ti, Al2O3, Zn, ZnO2 Layers with a thickness in the range of 400 to 600 nm

    Unit Each Run Amount : 7,000,000 Rls.
  • Deposition of Cr, Si, SiO2, Ni, Cu, Ge, Au, ITO, Ti, Al2O3, Zn, ZnO2 Layers with a thickness in the range of 600 to 10

    Unit Each Run Amount : 11,000,000 Rls.