In order to connect Die to the chip package, use of bonding process is inevitable. This process is carried out using a wire bonding machine and gold wire. The influential parameters in this process are temperature and ultrasonic power. By using this equipment, the 150 μm gold wire is bonded between Die and the chip package. A proper bonding mainly depends on the quality of the deposited gold layer onto the die, bonding temperature, ultrasonic power, needle quality, as well as operator’s skill.