Dicing Machine for Wafer Cutting

Sample Preparation

Several methods are used to slice silicon wafers. In this service, a Dicing Machine equipped with a diamond blade is used to cut a wafer into the desired dimensions. The main feature of this method is its completely straight cuts and smooth edges which are very useful in cutting the wafer into the same dimensions. In this process, according to a predefined program, a silicon wafer is cut using a high-speed diamond blade while at the same time water is also sprayed.


  • Wafer Cutting

    Unit Complete Wafer Amount : 2,000,000 Rls.
  • Wafer Cutting

    Unit Each Line Amount : 200,000 Rls.